Chip-On-Board / Chip-On-Flex / Bare Die Assemblies

ET's factory is a leading edge, integrated electronics manufacturing facility. In addition to conventional electronics assembly, we offer wire-bonding and flip-chip technology for chip on board and chip on flex applications. Utilizing bare die will ensure cost savings while effectively reducing the size of your next generation products.

Examples of ET Die Assemblies

(click image to enlarge)

Chip-on-Rigid-Flex	Chip-on-Board
Chip-on-Flex	Chip-on-Flex

ET's broad bare die capabilities include:

• Bare die on any substrate - FR4, thin board, flex, rigid flex, exotic materials
• Die attach
• Gold wire bonding; gold or aluminum wedge bonding
• Encapsulation, glob-top or dam and fill
• Flip chip
• Underfill

Click here to request more information or a quote.

Click here to request more information or a quote.

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