These adapters enable you to adapt 6 to 32-pin DIPs to LAP-type footprints. These devices have a two-piece construction: a top DIP assembly with interconnects to a LAP surface-mountable assembly that is soldered to the target PC board and then, the top assembly is plugged onto it.

Features

Adapters can be used for prototyping SMT boards with DIP devices
Provide interconnects to SMT patterns for testing
Constructed with gold-plated machined pin contacts for high reliability

How to Order

1) Locate the part number with the correct number of pins from the emulator pod and target socket.
2) Locate your footprint in the footprint section.
3) All parts are wired 1-to-1, top to bottom.

EMULATOR POD DIP => TARGET LAP PADS

Description	Top Socket	Bottom Socket	Lead Pitch (mm)	Body Size (mm)	PDF
AS-DIP.3-008-LAP2S-1	0.3" DIP	2 piece LAP	1.27	4.90 x 6.00	PDF

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