Hi-Lo Flexible Interconnect System
(up to 9.3 GHz)
High Density Module Application
This all new connector design incorporates the highs, the lows, and the application flexibility the industry requires.
Highs
High Density: 0.8mm pitch and above
High Speed: 1 dB cut-off measured at 9.3 GHz
High Reliability: Proven dual-beam gold plated beryllium copper contacts
High I/O: Over 2000 I/O
High Speed Assembly: Pick and place compatible
Lows
Low Profile: Socket height less than 2mm
Low Cost: As low as $0.02/contact in high volume
Low Insertion Force: 1.0 oz per contact
Low Tooling Cost: Tooling cost for custom footprints less than $1000
Flexibility
Any Application:
Includes both pin and socket arrays to accommodate multiple applications: BGA production socket, board-to-board connector, any creative use
Quick Delivery: Prototype quantities shipped in 2 weeks
Any Footprint: Not limited to standard arrays or geometries
CTE Compliant: Designed to accommodate thermal mismatch
Test Reports:
BGA Socketing Application
1152 Position Pin Field & Socket
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